Skyworks and Sequans Deliver World's First Solution Optimized for LTE Category M Applications
Combines Skyworks'
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"Sequans is excited to be partnering with
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About Skyworks' and Sequans' Solution
Sequans' Monarch LTE Cat M single chip supports both Category M1 and M2 of the narrowband LTE user equipment categories defined in 3GPP Release 13. The Monarch chip integrates the baseband, RF transceiver, memory and power management functionality in a small 6.5 x 8 mm package, and is optimized for half-duplex FDD with intelligent on-chip RF filtering for global band support. When combined with Skyworks' SKY68000-11 front-end module, an ultra-compact, fully integrated multi-band solution integrating all the active and passive RF front-end components, the solution provides one of the most highly optimized LTE platforms for IoT applications available today.
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About LTE Category M
The deployment of 3GPP Release 13 LTE networks and devices supporting Category M1 and M2 is expected to commence with trials in 2016 and commercialization in 2017. These low-cost/low-power narrowband connectivity solutions will enable low data rate applications and will find high usage in large scale deployments such as smart meters, sensors and monitors for the smart city, agriculture, industrial, the environment and the smart home, consumer and healthcare wearables, and ubiquitous asset tracking tags for vehicles, cargo, children, the elderly, pets and even luggage.
Technical Note to Editors
What is now known as Category M1 was formerly called Category M. Cat M1 specifies operation in 1.4 MHz bandwidth channels, providing approximately 300 kbps downlink and 375 kpbs uplink speeds in half-duplex FDD. Category M2 was formerly called narrowband IoT (NB-IoT). Cat M2 specifies operation in 200 kHz bandwidth channels, providing approximately 40 kbps downlink and 55 kbps uplink speeds in half-duplex FDD. With the completion of 3GPP Release 13, the M1 and M2 category designations will become official.
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Sequans Forward Looking Statements
This press release may contain projections or other forward-looking statements regarding future events or Sequans Communications' future financial performance. All statements other than present and historical facts and conditions contained in this release, including any statements regarding Sequans Communications' future results of operations and financial positions, business strategy, plans and objectives for future operations, are forward-looking statements (within the meaning of the Private Securities Litigation Reform Act of 1995, Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended).
These statements are only predictions and reflect
Some of the factors that could cause actual results to differ materially
from the forward-looking statements contained herein include, without
limitation: (i) the contraction or lack of growth of markets in which
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These risks, uncertainties and other important factors include, but are
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the markets addressed by our, and our customers', products to economic
downturns; the timing, rescheduling or cancellation of significant
customer orders and our ability, as well as the ability of our
customers, to manage inventory; losses or curtailments of purchases or
payments from key customers, or the timing of customer inventory
adjustments; the availability and pricing of third-party semiconductor
foundry, assembly and test capacity, raw materials and supplier
components; changes in laws, regulations and/or policies that could
adversely affect either (i) the economy and our customers' demand for
our products or (ii) the financial markets and our ability to raise
capital; our ability to develop, manufacture and market innovative
products in a highly price competitive and rapidly changing
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operate, including security and health risks, possible disruptions in
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rates; fluctuations in our manufacturing yields due to our complex and
specialized manufacturing processes; delays or disruptions in production
due to equipment maintenance, repairs and/or upgrades; our reliance on
several key customers for a large percentage of our sales; fluctuations
in the manufacturing yields of our third-party semiconductor foundries
and other problems or delays in the fabrication, assembly, testing or
delivery of our products; our ability to timely and accurately predict
market requirements and evolving industry standards, and to identify
opportunities in new markets; uncertainties of litigation, including
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as well as payments related to the licensing and/or sale of such rights;
our ability to rapidly develop new products and avoid product
obsolescence; our ability to retain, recruit and hire key executives,
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needed to implement our business and product plans; lengthy product
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or delays that we may face in shifting our products to smaller geometry
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