Skyworks Powers Leading Gaming Platforms
Next Generation Consoles Leveraging Company's FEMs, LNAs and Analog Solutions
(Photo: Business Wire)
"Skyworks is proud to be at the heart of all leading gaming platforms,"
said
According to Gartner's "Forecast: Video Game Ecosystem, Worldwide 4Q13"
report, the worldwide video game marketplace, which includes video game
console hardware and software, online mobile and PC games, is forecasted
to reach
About Skyworks' Gaming Solutions
- AS179-000 is a monolithic, single pole double throw switch (SPDT) fabricated using Skyworks' proprietary gallium arsenide, pseudomorphic high electron mobility transistors as the switching elements.
- AS179-92LF is an integrated circuit, field effect transistor SPDT switch in a low cost, miniature SC-70, six-lead plastic package.
- SE2568U is a complete, high efficiency 802.11 b/g wireless local area network discrete power amplifier (PA).
- SE2574BL-R is a complete 802.11 b/g/n WLAN discrete PA.
- SE2597L is a PA with power detector designed for use in the 2.4 gigahertz (GHz), industrial-scientific-medical band for WLAN applications.
- SE2614BT is a complete, high efficiency 802.11 b/g/n WLAN front-end module (FEM) providing all the functionality of the PA, power detector, single pole triple throw switch and 50 ohm matching on all radio frequency ports in an ultra compact form factor.
- SE2621L is a complete, high efficiency 802.11b/g/n WLAN FEM providing all the functionality of the PA, power detector, double pole double throw switch for diversity antenna and 50 ohm matching on all RF ports in an ultra-compact form factor.
- SE5008L is a single chip integrated FEM with a low noise amplifier utilizing bypass mode for tolerance to near field power, and a SPDT switch to complement WLAN chipsets with an integrated 5 GHz PA.
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These risks, uncertainties and other important factors include, but are
not limited to: uncertainty regarding global economic and financial
market conditions; the susceptibility of the semiconductor industry and
the markets addressed by our, and our customers', products to economic
downturns; the timing, rescheduling or cancellation of significant
customer orders and our ability, as well as the ability of our
customers, to manage inventory; losses or curtailments of purchases or
payments from key customers, or the timing of customer inventory
adjustments; the availability and pricing of third party semiconductor
foundry, assembly and test capacity, raw materials and supplier
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adversely affect either (i) the economy and our customers' demand for
our products or (ii) the financial markets and our ability to raise
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products in a highly price competitive and rapidly changing
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transportation networks and fluctuations in foreign currency exchange
rates; fluctuations in our manufacturing yields due to our complex and
specialized manufacturing processes; delays or disruptions in production
due to equipment maintenance, repairs and/or upgrades; our reliance on
several key customers for a large percentage of our sales; fluctuations
in the manufacturing yields of our third party semiconductor foundries
and other problems or delays in the fabrication, assembly, testing or
delivery of our products; our ability to timely and accurately predict
market requirements and evolving industry standards, and to identify
opportunities in new markets; uncertainties of litigation, including
potential disputes over intellectual property infringement and rights,
as well as payments related to the licensing and/or sale of such rights;
our ability to rapidly develop new products and avoid product
obsolescence; our ability to retain, recruit and hire key executives,
technical personnel and other employees in the positions and numbers,
with the experience and capabilities, and at the compensation levels
needed to implement our business and product plans; lengthy product
development cycles that impact the timing of new product introductions;
unfavorable changes in product mix; the quality of our products and any
remediation costs; shorter than expected product life cycles; problems
or delays that we may face in shifting our products to smaller geometry
process technologies and in achieving higher levels of design
integration; and our ability to continue to grow and maintain an
intellectual property portfolio and obtain needed licenses from third
parties, as well as other risks and uncertainties, including, but not
limited to, those detailed from time to time in our filings with the
The forward-looking statements contained in this news release are made only as of the date hereof, and we undertake no obligation to update or revise the forward-looking statements, whether as a result of new information, future events or otherwise.
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