Skyworks Powers MediaTek’s Latest Generation Dual-core Smartphone Platforms
The MT6572 is the world’s first dual-core, system-on-a-chip platform with high-speed-packet-access, integrated WiFi, FM, GPS and Bluetooth® functionality delivered in a cost-effective, four-layer printed circuit board. This system-level design reduces bill-of-material costs, simplifies the product development cycle and enhances time to market – all key drivers in the fast moving mobile market.
“MediaTek is excited to be extending its collaboration with Skyworks
Solutions,” said
“As the transition to smartphones in the emerging markets continues to
accelerate, Skyworks is pleased to be working with
Industry analysts expect future smartphone growth to come from emerging markets where consumers are upgrading from feature phones to entry-level platforms. According to IDC, 1.7 billion smart connected devices (tablets, smartphones and PCs) will be shipped worldwide in 2014. Of those 1.7 billion units, 1.0 billion will be delivered to emerging markets, with smartphones and tablets comprising more than the majority of units. Specifically, IDC estimates emerging markets will see a compound annual growth rate of 17 percent from 2012 – 2017 for connected devices.
About the MT6572
Leveraging the breakthrough technology and market momentum of the flagship MT6589 quad-core HSPA+ platform, the new MT6572 integrates a power-efficient, dual-core Cortex™-A7 central processing unit sub-system with speeds up to 1.2 gigahertz in 28 nanometers. The new platform also integrates MediaTek’s advanced, multimode Rel. 8 HSPA+/TD-SCDMA modem, 3G graphics, support up to HD 720p video playback and record, 5 megapixel camera and up to qHD displays. Supporting the leading picture quality technologies inherited from MediaTek’s extensive experience in the digital television market, the MT6572 delivers an innovative solution that offers the finest visual quality and outstanding user experience for high-end smartphone consumers.
About Skyworks’ Front-end Solutions
The fully matched, 14-pad SKY77758 power amplifier (PA) module packs full coverage for Bands I, II, V, VIII into a single, compact 3.0 x 4.2 x 0.9 millimeter (mm) package. The small and efficient surface mount module meets stringent spectral linearity requirements for WCDMA, HSDPA, HSUPA, HSPA+ transmission with high power-added efficiency. A directional coupler integrated into the module eliminates the need for any external coupler. The single gallium arsenide, microwave monolithic integrated circuit (MMIC) contains all active circuitry in the module. The MMIC contains on-board bias circuitry, as well as input and interstage matching circuits. Output match into a 50-ohm load is realized off-chip within the module package to optimize efficiency and power performance.
The SKY77590-11, SKY77590-21, SKY77590-51, SKY77590-61, SKY77593, SKY77594, SKY77595 and SKY77596 are transmit (Tx)/receive front-end modules designed in a very low profile (0.9 mm) and 6 x 6 mm compact form factor for quad-band cellular handsets comprising GSM850/900, DCS1800 and PCS 1900 operation. The complete transmit VCO-to-antenna and antenna-to-receive, surface acoustic wave filter modules consist of Tx harmonic filtering, a high linearity/low insertion loss switch, and a complementary metal-oxide semiconductor, PA control block. A custom Silicon integrated circuit contains decoder circuitry to control the RF switch while providing a low current, external control interface.
About Skyworks
Headquartered in
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or delays that we may face in shifting our products to smaller geometry
process technologies and in achieving higher levels of design
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Note to Editors: Skyworks and
Source:
Skyworks Media Relations:
Pilar Barrigas, 949-231-3061
or
Skyworks
Investor Relations:
Stephen Ferranti, 781-376-3056