Skyworks Launches Family of Highly Innovative Connectivity Solutions for Smartphones and Tablets
Flip-chip Packaging Significantly Reduces Overall Footprint, Enabling Thinner Solutions for Mobile Platforms
(Photo: Business Wire)
"Skyworks' unique flip-chip packaging capabilities are enabling us to
offer unprecedented form factors in support of flagship smartphones and
tablets," said
Flip chip is a type of surface mountable packaging technology that reduces footprint and thickness (compared to conventional packaging), weighs less, is easy to assemble, lowers production costs and improves electrical and thermal performance. Flip-chip solutions combine the strengths of various packaging techniques, such as the size and performance advantage of bare die assembly with the reliability of encapsulated devices which can also be fully RF tested at die level. Their significant size and weight reduction makes them ideal for use in a variety of mobile devices including smartphones and tablets.
About Skyworks' Connectivity Solutions
SKY85202-11: a single-pole, triple-throw switch with an integrated LNA for 2.4 GHz, 802.11ac modules
SKY85606-11: a single-pole, double-throw switch with an integrated LNA for 5 GHz, 802.11ac modules
Both devices are highly integrated and feature an LNA with bypass mode, low loss RF switch and DC blocking capacitors in a single, compact flip-chip package. In addition, these Skyworks Green™ products are compliant with all applicable legislation and are halogen-free.
Additional products in this portfolio will be released later this year.
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